New Precision BGA Spheres Optimize Sphere Performance
Indium Corporation’s Solder Spheres for PBGA, CBGA, TBGA, µBGA¬ and Flip Chip applications are made by a proprietary manufacturing process that consistently results in high sphericity and accurate diameters.
The solder spheres are available in many alloys including industry standards:
If you have a unique specification for your solder spheres, please click here to request a quote.
Spheres Technical Documents
Safety Data Sheets
Solder Sphere Blog Posts
Spheres are the form of indium I use the most for testing solder wetting properties, because they have a precise volume. (As opposed to shot, which does not have as tightly controlled size or sphericity restrictions.) Spheres are commonly used as interconnections for flip-chip attachment and BGA devices.…
People use indium in many forms - to create many different products. Certain forms fit various applications. Here are some of the many forms of pure indium that we provide: Ingot – this is the bulk form of indium, but it can still be customized. Sizes are available from small ‘finger’…
While not directly part of Indium Corporation’s Technical Service department, Maria is technology driven and works with our customers to help select the perfect products for their needs. In her role as Product Specialist for Semiconductor and Advanced Assembly Materials she tests all of our newest…
Andy C. Mackie, PhD, MSc
Global Product Manager of Semiconductor and Advanced Assembly Materials
From One Engineer to Another®
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