New Precision BGA Spheres Optimize Sphere Performance
Indium Corporation’s Solder Spheres for PBGA, CBGA, TBGA, µBGA¬ and Flip Chip applications are made by a proprietary manufacturing process that consistently results in high sphericity and accurate diameters.
The solder spheres are available in many alloys including industry standards:
If you have a unique specification for your solder spheres, please click here to request a quote.
Spheres Technical Documents
Material Safety Data Sheets
Solder Sphere Blog Posts
While on a recent trip to Malaysia, I interviewed two colleagues regarding trends in semiconductor assembly. My previously-published interview with Sze-Pei Lim appears here. This time, while on a visit to a logic device manufacturer in the North West, I [ACM] talked briefly to Sehar Samiappan [SS],…
最近有一个客户向我们展示了他们公司新采用的“自动售卖机”库存管理系统（industrial vending machine）,真是大开眼界。在此和大家分享一下。 请看下面的图片。 这个自动售卖机和我们平时看见卖零食的机器表面上没什么大区别，最多是可以在机器旁边衍生多些大格子储存更多的货品。客户的采购员自豪的向我们介绍了采用这套系统后带来的好处（当然，所有好处都是围绕降低成本和容易系统管理） 免费机器，一年6%的rebate 拿到物品开始算钱:…
Maria Durham, Indium’s new Technical Specialist in Semiconductor and Advanced Assembly Materials, has been doing some research on indium lead (In/Pb) solder alloys. We chatted about her findings this week. [Andy C. Mackie: ACM] Which indium/lead solder alloys are most common, and…
This page is owned by:
Andy C. Mackie, PhD, MSc
Global Product Manager of Semiconductor and Advanced Assembly Materials
From One Engineer to Another®
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