Precision BGA Spheres Optimize Sphere Performance
Indium Corporation's manufactures solder spheres for PBGA, CBGA, TBGA, µBGA, and flip-chip applications. The solder spheres are made using a proprietary manufacturing process that provides consistently high sphericity and accurate diameters.
Indium Corporation can make almost any solder alloy sphere to suit customer needs. Standard alloys include both Pb-free and SnPb eutectic. Standard sphere diameters are commonly packaged in tape & reel and are listed below. We are constantly expanding and adapting our product offering to meet customer needs, so please contact us if you have a unique request.
We also offer two different standard diameter reels for tape & reel solder spheres:
|Reel Diameter||Pitch of Carrier Tape||Sphere Diameters||Maximum Spheres Per Reel|
Experience has shown us that consistent tape peel strength eliminates process start and stops and materials losses. Indium Corporation's manufacturing procedures and quality assurance eliminates these customer concerns.
Solder spheres are available in many alloys including industry standards:
If you have a unique specification for your solder spheres, please click here to request a quote.
Spheres Technical Documents
Safety Data Sheets
Solder Sphere Blog Posts
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.