New Precision BGA Spheres Optimize Sphere Performance
Indium Corporation’s Solder Spheres for PBGA, CBGA, TBGA, µBGA¬ and Flip Chip applications are made by a proprietary manufacturing process that consistently results in high sphericity and accurate diameters.
The solder spheres are available in many alloys including industry standards:
If you have a unique specification for your solder spheres, please click here to request a quote.
Spheres Technical Documents
Safety Data Sheets
Solder Sphere Blog Posts
I just can’t get enough of a good thing. My last post mentioned donuts – one of my favorite treats. Allow me to continue reveling in the chewy sweet delight. On Saturdays the kids like to be taken for donuts; it usually doesn’t take much convincing. But, it’s not…
Folks, Some years ago, a leading IC manufacturer decided that their R&D effort could benefit if analyzed for possible improvement - by hiring professionals from the arts (e.g. singers, actors, artists etc.) In this spirit, I am going not quite so far from electronics assembly, to ask one…
Spheres are the form of indium I use the most for testing solder wetting properties, because they have a precise volume. (As opposed to shot, which does not have as tightly controlled size or sphericity restrictions.) Spheres are commonly used as interconnections for flip-chip attachment and BGA devices.…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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