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Spheres

Home » Products » Solders » Spheres

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Solder Spheres Solder Spheres

New Precision BGA Spheres Optimize Sphere Performance

Indium Corporation’s Solder Spheres for PBGA, CBGA, TBGA, µBGA¬ and Flip Chip applications are made by a proprietary manufacturing process that consistently results in high sphericity and accurate diameters.

The solder spheres are available in many alloys including industry standards:

  • Sn63Pb37
  • Sn62Pb36Ag2
  • Pb90Sn10
  • Pb89.5Sn10.5.

If you have a unique specification for your solder spheres, please click here to request a quote.

Related Markets and Applications

  • Semiconductor and Advanced Assembly
  • Engineered Solder and Alloys

Top Spheres Technical Documents

  • Solder Alloy Chart (Letter)

    Product Data Sheet

  • Precision Solder Spheres (Letter) (A4)

    Product Data Sheet

  • Indalloy® 4 (Indium)

    MSDS

Equipment Partners

  • Pac Tech
  • Hanmi
  • Shibuya

Spheres Technical Documents

Whitepapers

Request This Document

Options and Concerns of BGA Solder Bumping

Authors: Dr. Chingchen S. Chiu, Dr. Ning-Cheng Lee

Posted on 1 Jan 2009

Request This Document

Solder Bumping Via Paste Reflow For Area Array Packages

Authors: Dr. Benlih Huang, Dr. Ning-Cheng Lee

Posted on 1 Jan 2009

Request This Document

Solder-Ball Manufacturing and Attachment for BGAs

Authors: Dr. Ning-Cheng Lee

Posted on 1 Jan 2009

Request This Document

Soldering Technology for Area Array Packages

Authors: Dr. Ning-Cheng Lee, William Casey

Posted on 10 Mar 2010

View All

Application Notes

Procedures for Handling Indalloys (Liquid at Room Temperature) (Letter)

Product Data Sheets

Precision Solder Spheres (Letter) (A4)
Solder Alloy Chart (Letter)

Material Safety Data Sheets

Indalloy® 128 (Tin)
Indalloy® 176 (Zinc Metal Mix)
Indalloy® 207
Indalloy® Containing Indium with Tin, Lead, Silver, Copper
Indalloy® Tin and Lead Only
Indalloy® with Lead, Zinc and Antimony
Indalloy® 170 (Lead)
Indalloy® 193
Indalloy® 4 (Indium)
Indalloy® Indium with Tin, Lead or Silver
Indalloy® with Lead and/or Tin and/or Silver and Antimony
Indalloy® with Tin, Lead and/or Silver and/or Copper

View All

Solder Sphere Blog Posts

Ball-Attach Flux WS-446-NRD for Poor Quality OSP-wetting

Friday, September 21, 2012 by Dr. Andy Mackie [view bio]

While on a recent trip to Malaysia, I interviewed two colleagues regarding trends in semiconductor assembly. My previously-published interview with Sze-Pei Lim appears here. This time, while on a visit to a logic device manufacturer in the North West, I [ACM] talked briefly to Sehar Samiappan [SS],…

物流管理---工业界的“自动售卖机”Industrial Vending Machine In Electronics Assembly

Tuesday, July 17, 2012 by Anny Zhang [view bio]

最近有一个客户向我们展示了他们公司新采用的“自动售卖机”库存管理系统(industrial vending machine),真是大开眼界。在此和大家分享一下。 请看下面的图片。 这个自动售卖机和我们平时看见卖零食的机器表面上没什么大区别,最多是可以在机器旁边衍生多些大格子储存更多的货品。客户的采购员自豪的向我们介绍了采用这套系统后带来的好处(当然,所有好处都是围绕降低成本和容易系统管理) 免费机器,一年6%的rebate 拿到物品开始算钱:…

Indium-Lead (In/Pb) Solder Alloys for Reliable Gold Interconnects in Semiconductor Assembly

Tuesday, April 03, 2012 by Dr. Andy Mackie [view bio]

Maria Durham, Indium’s new Technical Specialist in Semiconductor and Advanced Assembly Materials, has been doing some research on indium lead (In/Pb) solder alloys. We chatted about her findings this week.   [Andy C. Mackie: ACM] Which indium/lead solder alloys are most common, and…

View All Blog Posts

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Andy C. Mackie, PhD, MSc

This page is owned by:

Andy C. Mackie, PhD, MSc
Global Product Manager of Semiconductor and Advanced Assembly Materials
amackie@indium.com

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