New Precision BGA Spheres Optimize Sphere Performance
Indium Corporation’s Solder Spheres for PBGA, CBGA, TBGA, µBGA¬ and Flip Chip applications are made by a proprietary manufacturing process that consistently results in high sphericity and accurate diameters.
The solder spheres are available in many alloys including industry standards:
If you have a unique specification for your solder spheres, please click here to request a quote.
Spheres Technical Documents
Safety Data Sheets
Solder Sphere Blog Posts
In our continued investigation and quest to improve solder paste printing for fine-feature paste deposits, we also found that consistency (low standard deviation) favored the square apertures when comparing circular apertures to square apertures with radius corners (hereafter referred to only as square…
I just can’t get enough of a good thing. My last post mentioned donuts – one of my favorite treats. Allow me to continue reveling in the chewy sweet delight. On Saturdays the kids like to be taken for donuts; it usually doesn’t take much convincing. But, it’s not…
Folks, Some years ago, a leading IC manufacturer decided that their R&D effort could benefit if analyzed for possible improvement - by hiring professionals from the arts (e.g. singers, actors, artists etc.) In this spirit, I am going not quite so far from electronics assembly, to ask one of…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.