Tim Jensen, da Indium Corporation, discute a anulação de componentes QFN e o facto de ser um desafio significativo na indústria, especialmente para a almofada térmica.
Palavras-chave: Anulação, Tim Jensen, Componentes QFN, Almofada Térmica, QFN, Indium Corporation, Indium, LV1000, Preforma Revestida com Fluxo, Preformas, Fita e bobina, Evitar a Anulação, [email protected]
Innovative Metal TIMs for AI/GPU Processors As artificial intelligence (AI) and high-performance computing (HPC) technologies evolve, their computational demands have skyrocketed, leading to a
When people think of advancements in medical technology, things like surgery-assisting robots, AI diagnostics, or neurostimulators – like Neuralink’s ‘Blindsight’ –
It’s no secret that indium and indium-silver solder thermal interface materials (TIMs) show great potential for maximizing thermal performance in high-performance computing (HPC) and AI
