Indium Corporation 的 Tim Jensen 讨论了 QFN 元件下的空洞问题，以及它如何成为行业内的一个重大挑战，尤其是对隔热垫而言。
关键字Voiding, Tim Jensen, QFN Components, Thermal Pad, QFN, Indium Corporation, Indium, LV1000, Flux Coated Preform, Preforms, Tape and reel, Avoid the Void, [email protected]
Innovative Metal TIMs for AI/GPU Processors As artificial intelligence (AI) and high-performance computing (HPC) technologies evolve, their computational demands have skyrocketed, leading to a
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It’s no secret that indium and indium-silver solder thermal interface materials (TIMs) show great potential for maximizing thermal performance in high-performance computing (HPC) and AI
