Indium Corporation’s Vice President of Technology Dr. Ning-Cheng Lee will deliver the keynote presentation at the IMAPS 44th International Symposium on Microelectronics, October 9-13, 2011, in Long Beach, CA. His presentation, Trends of Solder Alloy Development, will discuss the evolution of lead-free soldering as the industry moves rapidly toward green manufacturing.
In addition, Indium Corporation will be presenting four papers at the technical conference.
Dr. Lee will present Epoxy Flux – A Low Cost High Reliability Approach for PoP Assembly. This paper describes the benefits of using epoxy flux to reinforce the solder joints of assembled package-on-package (PoP).
Ronald C. Lasky, Ph.D., P.E., Senior Technologist, will present Applications of Solder Preforms to Improve Reliability, which explains the process, design, and assembly methods for solder fortification® using preforms.
Seth J. Homer, Product Specialist, will present Evaluation of Test Protocol for Eutectic Die-Attach using High Power LEDs. This paper details process recommendations for the implementation of eutectic gold-tin (AuSn) materials in high-power semiconductor devices, such as high-brightness LEDs.
Jacques Matteau, Global Sales Manager, will present Nanobond® Assembly: A Rapid, Room Temperature Soldering Process, which describes the benefits, process, and applicability of this revolutionary technology.
O Dr. Lee é um especialista em soldadura de renome mundial e um Membro de Distinção da SMTA. Tem uma vasta experiência no desenvolvimento de polímeros de alta temperatura, encapsulantes para microeletrónica, subenchimentos e adesivos. Os seus actuais interesses de investigação abrangem materiais avançados para interconexões e embalagens para aplicações electrónicas e optoelectrónicas, com ênfase tanto no elevado desempenho como no baixo custo de propriedade.
Dr. Lasky has more than 30 years experience in electronic and optoelectronic packaging and assembly, including work at IBM, Universal Instruments, and Cookson Electronics. He has authored or edited five books on science, electronics, and optoelectronics, as well as several technical papers and articles for Scientific American. Dr. Lasky holds numerous patent disclosures and is the developer of several new concepts in SMT processing software relating to cost estimating, line balancing and process optimization. He is the co-creator of engineering certification exams in electronics assembly and is the director of Dartmouth’s Six Sigma Program. Dr. Lasky was awarded the SMTA Founder’s Award in 2003. He also authors a technology blog which can be found at blogs.indium.com/blog/an-interview-with-the-professor.
Seth trabalha na Indium Corporation há mais de 15 anos, como supervisor de fabrico de vários materiais de montagem de eletrónica, incluindo esferas de solda, alvos de pulverização, produtos químicos de índio e pré-formas de solda. Seth também trabalhou extensivamente com as equipas de apoio ao cliente da Indium Corporation, especialmente as da China, Singapura e Europa. É também autor de um blogue que pode ser consultado em blogs.indium.com/blog/seth-j-homer.
Jacques is responsible for driving the market development and sales of Indium Corporation’s NanoFoil® products to the target industry, where it is used to NanoBond® targets to the backing plate. His focus is on semiconductor, disk drive, and solar industries throughout Asia, Europe, and the US. Jacques has over 20 years of experience with thin film technologies and the electronics industry. He has a strong technical materials background with a degree in Physical Chemistry and Materials Science from the University of Ottawa.
Indium Corporation will be at booth #235.
For more information about IMAPS 2011, visit www.imaps.org/imaps2011.
A Indium Corporation é um dos principais fornecedores de materiais para os mercados globais de eletrónica, semicondutores, energia solar, película fina e gestão térmica. Os produtos incluem soldas, pré-formas e fluxos; brasagens; alvos de pulverização; produtos químicos e fornecimento de índio, gálio e germânio; e Reactive NanoFoil®. Fundada em 1934, a Indium tem apoio técnico global e fábricas localizadas na China, Singapura, Coreia do Sul, Reino Unido e EUA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
