Indium Corporation’s Vice President of Technology Dr. Ning-Cheng Lee will deliver the keynote presentation at the IMAPS 44th International Symposium on Microelectronics, October 9-13, 2011, in Long Beach, CA. His presentation, Trends of Solder Alloy Development, will discuss the evolution of lead-free soldering as the industry moves rapidly toward green manufacturing.
In addition, Indium Corporation will be presenting four papers at the technical conference.
Dr. Lee will present Epoxy Flux – A Low Cost High Reliability Approach for PoP Assembly. This paper describes the benefits of using epoxy flux to reinforce the solder joints of assembled package-on-package (PoP).
Ronald C. Lasky, Ph.D., P.E., Senior Technologist, will present Applications of Solder Preforms to Improve Reliability, which explains the process, design, and assembly methods for solder fortification® using preforms.
Seth J. Homer, Product Specialist, will present Evaluation of Test Protocol for Eutectic Die-Attach using High Power LEDs. This paper details process recommendations for the implementation of eutectic gold-tin (AuSn) materials in high-power semiconductor devices, such as high-brightness LEDs.
Jacques Matteau, Global Sales Manager, will present Nanobond® Assembly: A Rapid, Room Temperature Soldering Process, which describes the benefits, process, and applicability of this revolutionary technology.
Lee 博士是世界知名的焊接專家，也是 SMTA 的優秀會員。他在高溫聚合物、微電子封裝材料、底部填充物和粘合劑的開發方面擁有豐富的經驗。他目前的研究興趣涵蓋用於電子和光電應用的互連和封裝的先進材料，強調高性能和低擁有成本。
Dr. Lasky has more than 30 years experience in electronic and optoelectronic packaging and assembly, including work at IBM, Universal Instruments, and Cookson Electronics. He has authored or edited five books on science, electronics, and optoelectronics, as well as several technical papers and articles for Scientific American. Dr. Lasky holds numerous patent disclosures and is the developer of several new concepts in SMT processing software relating to cost estimating, line balancing and process optimization. He is the co-creator of engineering certification exams in electronics assembly and is the director of Dartmouth’s Six Sigma Program. Dr. Lasky was awarded the SMTA Founder’s Award in 2003. He also authors a technology blog which can be found at blogs.indium.com/blog/an-interview-with-the-professor.
Seth 在 Indium Corporation 工作超過 15 年，擔任各種工程電子組裝材料的製造主管，包括焊球、濺鍍靶材、铟化學品和焊料預型件。Seth 也曾與 Indium Corporation 的客戶支援團隊廣泛合作，尤其是在中國、新加坡和歐洲。他也撰寫部落格，網址是blogs.indium.com/blog/seth-j-homer。
Jacques is responsible for driving the market development and sales of Indium Corporation’s NanoFoil® products to the target industry, where it is used to NanoBond® targets to the backing plate. His focus is on semiconductor, disk drive, and solar industries throughout Asia, Europe, and the US. Jacques has over 20 years of experience with thin film technologies and the electronics industry. He has a strong technical materials background with a degree in Physical Chemistry and Materials Science from the University of Ottawa.
Indium Corporation will be at booth #235.
For more information about IMAPS 2011, visit www.imaps.org/imaps2011.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料供應商。產品包括焊料、預成型品和助熔劑；钎料；濺鍍靶材；铟、鎵和锗化學品和採購；以及 Reactive NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
