Indium Corporation’s Vice President of Technology Dr. Ning-Cheng Lee will deliver the keynote presentation at the IMAPS 44th International Symposium on Microelectronics, October 9-13, 2011, in Long Beach, CA. His presentation, Trends of Solder Alloy Development, will discuss the evolution of lead-free soldering as the industry moves rapidly toward green manufacturing.
In addition, Indium Corporation will be presenting four papers at the technical conference.
Dr. Lee will present Epoxy Flux – A Low Cost High Reliability Approach for PoP Assembly. This paper describes the benefits of using epoxy flux to reinforce the solder joints of assembled package-on-package (PoP).
Ronald C. Lasky, Ph.D., P.E., Senior Technologist, will present Applications of Solder Preforms to Improve Reliability, which explains the process, design, and assembly methods for solder fortification® using preforms.
Seth J. Homer, Product Specialist, will present Evaluation of Test Protocol for Eutectic Die-Attach using High Power LEDs. This paper details process recommendations for the implementation of eutectic gold-tin (AuSn) materials in high-power semiconductor devices, such as high-brightness LEDs.
Jacques Matteau, Global Sales Manager, will present Nanobond® Assembly: A Rapid, Room Temperature Soldering Process, which describes the benefits, process, and applicability of this revolutionary technology.
Le Dr Lee est un expert en brasage de renommée mondiale et un membre de distinction de la SMTA. Il possède une vaste expérience dans le développement de polymères à haute température, d'encapsulants pour la microélectronique, de sous-remplissages et d'adhésifs. Ses recherches actuelles portent sur les matériaux avancés pour les interconnexions et l'emballage pour les applications électroniques et optoélectroniques, en mettant l'accent sur la haute performance et le faible coût de possession.
Dr. Lasky has more than 30 years experience in electronic and optoelectronic packaging and assembly, including work at IBM, Universal Instruments, and Cookson Electronics. He has authored or edited five books on science, electronics, and optoelectronics, as well as several technical papers and articles for Scientific American. Dr. Lasky holds numerous patent disclosures and is the developer of several new concepts in SMT processing software relating to cost estimating, line balancing and process optimization. He is the co-creator of engineering certification exams in electronics assembly and is the director of Dartmouth’s Six Sigma Program. Dr. Lasky was awarded the SMTA Founder’s Award in 2003. He also authors a technology blog which can be found at blogs.indium.com/blog/an-interview-with-the-professor.
Seth travaille pour Indium Corporation depuis plus de 15 ans, en tant que superviseur de la fabrication de divers matériaux d'assemblage électronique, notamment des sphères de soudure, des cibles de pulvérisation, des produits chimiques à base d'indium et des préformes de soudure. Seth a également beaucoup travaillé avec les équipes d'assistance à la clientèle d'Indium Corporation, en particulier en Chine, à Singapour et en Europe. Il est également l'auteur d'un blog que l'on peut consulter à l'adresse blogs.indium.com/blog/seth-j-homer.
Jacques is responsible for driving the market development and sales of Indium Corporation’s NanoFoil® products to the target industry, where it is used to NanoBond® targets to the backing plate. His focus is on semiconductor, disk drive, and solar industries throughout Asia, Europe, and the US. Jacques has over 20 years of experience with thin film technologies and the electronics industry. He has a strong technical materials background with a degree in Physical Chemistry and Materials Science from the University of Ottawa.
Indium Corporation will be at booth #235.
For more information about IMAPS 2011, visit www.imaps.org/imaps2011.
Indium Corporation est un fournisseur de matériaux de premier plan pour les marchés mondiaux de l'électronique, des semi-conducteurs, de l'énergie solaire, des couches minces et de la gestion thermique. Ses produits comprennent des soudures, des préformes et des flux, des brasures, des cibles de pulvérisation, des produits chimiques et des sources d'approvisionnement en indium, gallium et germanium, ainsi que Reactive NanoFoil®. Fondée en 1934, Indium dispose d'une assistance technique mondiale et d'usines situées en Chine, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
