Indium Corporation’s Vice President of Technology Dr. Ning-Cheng Lee will deliver the keynote presentation at the IMAPS 44th International Symposium on Microelectronics, October 9-13, 2011, in Long Beach, CA. His presentation, Trends of Solder Alloy Development, will discuss the evolution of lead-free soldering as the industry moves rapidly toward green manufacturing.
In addition, Indium Corporation will be presenting four papers at the technical conference.
Dr. Lee will present Epoxy Flux – A Low Cost High Reliability Approach for PoP Assembly. This paper describes the benefits of using epoxy flux to reinforce the solder joints of assembled package-on-package (PoP).
Ronald C. Lasky, Ph.D., P.E., Senior Technologist, will present Applications of Solder Preforms to Improve Reliability, which explains the process, design, and assembly methods for solder fortification® using preforms.
Seth J. Homer, Product Specialist, will present Evaluation of Test Protocol for Eutectic Die-Attach using High Power LEDs. This paper details process recommendations for the implementation of eutectic gold-tin (AuSn) materials in high-power semiconductor devices, such as high-brightness LEDs.
Jacques Matteau, Global Sales Manager, will present Nanobond® Assembly: A Rapid, Room Temperature Soldering Process, which describes the benefits, process, and applicability of this revolutionary technology.
이 박사는 세계적으로 유명한 납땜 전문가이자 SMTA 우수 회원입니다. 그는 고온 폴리머, 마이크로일렉트로닉스용 인캡슐런트, 언더필 및 접착제 개발 분야에서 폭넓은 경험을 보유하고 있습니다. 현재 그의 연구 관심 분야는 전자 및 광전자 애플리케이션을 위한 인터커넥트 및 패키징용 첨단 소재이며, 고성능과 낮은 소유 비용에 중점을 두고 있습니다.
Dr. Lasky has more than 30 years experience in electronic and optoelectronic packaging and assembly, including work at IBM, Universal Instruments, and Cookson Electronics. He has authored or edited five books on science, electronics, and optoelectronics, as well as several technical papers and articles for Scientific American. Dr. Lasky holds numerous patent disclosures and is the developer of several new concepts in SMT processing software relating to cost estimating, line balancing and process optimization. He is the co-creator of engineering certification exams in electronics assembly and is the director of Dartmouth’s Six Sigma Program. Dr. Lasky was awarded the SMTA Founder’s Award in 2003. He also authors a technology blog which can be found at blogs.indium.com/blog/an-interview-with-the-professor.
Seth는 인디엄 코퍼레이션에서 15년 이상 근무하면서 솔더 스피어, 스퍼터링 타겟, 인듐 화학물질, 솔더 프리폼 등 다양한 엔지니어링 전자 조립 재료의 제조 감독관으로 근무했습니다. 또한 중국, 싱가포르, 유럽 등 Indium Corporation의 고객 지원 팀과도 폭넓게 협력해 왔습니다. 또한 블로그( blogs.indium.com/blog/seth-j-homer)를 작성하고 있습니다.
Jacques is responsible for driving the market development and sales of Indium Corporation’s NanoFoil® products to the target industry, where it is used to NanoBond® targets to the backing plate. His focus is on semiconductor, disk drive, and solar industries throughout Asia, Europe, and the US. Jacques has over 20 years of experience with thin film technologies and the electronics industry. He has a strong technical materials background with a degree in Physical Chemistry and Materials Science from the University of Ottawa.
Indium Corporation will be at booth #235.
For more information about IMAPS 2011, visit www.imaps.org/imaps2011.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 공급하는 기업입니다. 주요 제품으로는 솔더, 프리폼 및 플럭스, 브레이즈, 스퍼터 타겟, 인듐, 갈륨, 게르마늄 화학물질 및 소싱, 반응성 나노포일® 등이 있습니다. 1934년에 설립된 Indium은 중국, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
