Indium Corporation’s Vice President of Technology Dr. Ning-Cheng Lee will deliver the keynote presentation at the IMAPS 44th International Symposium on Microelectronics, October 9-13, 2011, in Long Beach, CA. His presentation, Trends of Solder Alloy Development, will discuss the evolution of lead-free soldering as the industry moves rapidly toward green manufacturing.
In addition, Indium Corporation will be presenting four papers at the technical conference.
Dr. Lee will present Epoxy Flux – A Low Cost High Reliability Approach for PoP Assembly. This paper describes the benefits of using epoxy flux to reinforce the solder joints of assembled package-on-package (PoP).
Ronald C. Lasky, Ph.D., P.E., Senior Technologist, will present Applications of Solder Preforms to Improve Reliability, which explains the process, design, and assembly methods for solder fortification® using preforms.
Seth J. Homer, Product Specialist, will present Evaluation of Test Protocol for Eutectic Die-Attach using High Power LEDs. This paper details process recommendations for the implementation of eutectic gold-tin (AuSn) materials in high-power semiconductor devices, such as high-brightness LEDs.
Jacques Matteau, Global Sales Manager, will present Nanobond® Assembly: A Rapid, Room Temperature Soldering Process, which describes the benefits, process, and applicability of this revolutionary technology.
リー博士は世界的に著名なはんだ付けの専門家であり、SMTAの特別会員でもある。高温ポリマー、マイクロエレクトロニクス用封止材、アンダーフィル、接着剤の開発に豊富な経験を持つ。現在の研究テーマは、エレクトロニクスおよびオプトエレクトロニクス用途の相互接続およびパッケージング用の先端材料で、高性能と低所有コストの両方に重点を置いている。
Dr. Lasky has more than 30 years experience in electronic and optoelectronic packaging and assembly, including work at IBM, Universal Instruments, and Cookson Electronics. He has authored or edited five books on science, electronics, and optoelectronics, as well as several technical papers and articles for Scientific American. Dr. Lasky holds numerous patent disclosures and is the developer of several new concepts in SMT processing software relating to cost estimating, line balancing and process optimization. He is the co-creator of engineering certification exams in electronics assembly and is the director of Dartmouth’s Six Sigma Program. Dr. Lasky was awarded the SMTA Founder’s Award in 2003. He also authors a technology blog which can be found at blogs.indium.com/blog/an-interview-with-the-professor.
セスは、インジウム・コーポレーションに15年以上勤務し、はんだスフィア、スパッタリングターゲット、インジウム化学薬品、はんだプリフォームなど、さまざまな電子機器組立用エンジニアリング材料の製造監督者を務めています。また、インジウム・コーポレーションのカスタマー・サポート・チーム、特に中国、シンガポール、ヨーロッパのカスタマー・サポート・チームとも幅広く仕事をしてきました。また、blogs.indium.com/blog/seth-j-homerでブログを執筆しています。
Jacques is responsible for driving the market development and sales of Indium Corporation’s NanoFoil® products to the target industry, where it is used to NanoBond® targets to the backing plate. His focus is on semiconductor, disk drive, and solar industries throughout Asia, Europe, and the US. Jacques has over 20 years of experience with thin film technologies and the electronics industry. He has a strong technical materials background with a degree in Physical Chemistry and Materials Science from the University of Ottawa.
Indium Corporation will be at booth #235.
For more information about IMAPS 2011, visit www.imaps.org/imaps2011.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、太陽電池、薄膜、熱管理市場向けの一流材料サプライヤーです。製品には、はんだ、プリフォーム、フラックス、ろう材、スパッタターゲット、インジウム、ガリウム、ゲルマニウムの化学薬品および調達、Reactive NanoFoil®などがある。1934年に設立されたインジウムは、グローバルな技術サポートと中国、シンガポール、韓国、英国、米国に工場を有しています。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
