Indium Corporation’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Test Symposium (CSPT) on June 21-23 in Jiangyin, China.
Hu’s presentation, Challenges in Materials Application for SIP, will detail the solder paste characteristics required to achieve consistency in fine-feature printing using types 6 and 7 solder pastes. The presentation will also detail how to minimize bridging caused by the small gap between two adjacent pads, thus improving production yield.
Hu is based in Suzhou, China, and has more than 12 years experience in semiconductor packaging. He is a veteran in advanced assembly technology development, process improvement, and assembly materials application. He has served in many roles at top 10 outsourced assembly and test (OSAT) companies, including Process Engineer, Project Engineer, Senior R&D Engineer, and Chief Engineer. Hu earned a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a Indium tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
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