Indium Corporation’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Test Symposium (CSPT) on June 21-23 in Jiangyin, China.
Hu’s presentation, Challenges in Materials Application for SIP, will detail the solder paste characteristics required to achieve consistency in fine-feature printing using types 6 and 7 solder pastes. The presentation will also detail how to minimize bridging caused by the small gap between two adjacent pads, thus improving production yield.
Hu is based in Suzhou, China, and has more than 12 years experience in semiconductor packaging. He is a veteran in advanced assembly technology development, process improvement, and assembly materials application. He has served in many roles at top 10 outsourced assembly and test (OSAT) companies, including Process Engineer, Project Engineer, Senior R&D Engineer, and Chief Engineer. Hu earned a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
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