Indium Corporation’s Sze Pei Lim, Regional Product Manager for Semiconductor Products, will share her expertise at SEMICON South East Asia’s Advanced Packaging Forum on Wednesday, May 23, at the Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur, Malaysia.
Lim will present Challenges in Material Selection for SiP Applications. Her presentation discusses her recommended guidelines for selecting appropriate solder pastes and flip-chip fluxes for system-in-package (SiP) design and requirements within the packaging industry.
Lim has more than 20 years of experience in the PCB assembly and semiconductor packaging industries and is highly respected in her field. She earned her bachelor’s degree in chemistry from the National University of Singapore, is an SMTA-certified process engineer, and has a Six Sigma Green Belt. Lim joined Indium Corporation in 2007.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
Para mais informações sobre a Indium Corporation, visite www.indium.com ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer To Another® (#FOETA), em www.facebook.com/indium ou @IndiumCorp.
