Indium Corporation’s Sze Pei Lim, Regional Product Manager for Semiconductor Products, will share her expertise at SEMICON South East Asia’s Advanced Packaging Forum on Wednesday, May 23, at the Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur, Malaysia.
Lim will present Challenges in Material Selection for SiP Applications. Her presentation discusses her recommended guidelines for selecting appropriate solder pastes and flip-chip fluxes for system-in-package (SiP) design and requirements within the packaging industry.
Lim has more than 20 years of experience in the PCB assembly and semiconductor packaging industries and is highly respected in her field. She earned her bachelor’s degree in chemistry from the National University of Singapore, is an SMTA-certified process engineer, and has a Six Sigma Green Belt. Lim joined Indium Corporation in 2007.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, target per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
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