Um especialista da Indium Corporation irá apresentar estratégias de gestão térmica para aplicações de IA de próxima geração na Cimeira Global da OCP

CLINTON, N.Y., October 7, 2026 — Indium Corporation^® Senior Applications Development Engineer, Engineered Solder Materials (ESM), Ryan Mayberry will discuss how advanced metal thermal interface materials (TIMs) and liquid-cooled cold plates work together to maximize heat removal, boosting AI/HPC application performance and efficiency, at the Open Computer Project (OCP) Global Summit, October 12-15, in San Jose, California.

The presentation, Latest Advancements with Thermal Interface Materials, will present test data that quantifies how liquid metal TIMs and liquid-cooled cold plate co-optimization influence performance from the silicon interface through the cooling loop to data center-level metrics. Results will show how a 10°C die-level temperature reduction can propagate through the cooling architecture, increasing thermal headroom, supporting higher coolant operating temperatures, reducing cooling energy demand, and improving efficiency metrics such as PUE and compute performance per watt. The study was conducted in collaboration with CoolIT Systems.

Ryan Mayberry leads the application development team for the Indium Corporation ESM product line. He collaborates across internal functions to develop process recommendations, build test platforms and prototype assemblies, and support new product introduction, primarily in the growing power electronics and thermal management market segments.

OCP Global Summit visitors can attend Mayberry’s presentation on October 15, 12:30 PDT. To learn more about Indium Corporation’s TIMs solutions, visit indium.com.

Sobre a Indium Corporation

^A Indium^{Corporation®} é uma empresa líder na refinação, fundição, fabrico e fornecimento de materiais para os mercados globais de eletrónica, semicondutores, películas finas e gestão térmica. Os produtos incluem soldas e fluxos; ligas de brasagem; materiais de interface térmica; alvos de pulverização catódica; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e^NanoFoil®. Fundada em 1934, a empresa dispõe de apoio técnico global e fábricas localizadas na China, Alemanha, Índia, Malásia, México, Singapura, Coreia do Sul, Reino Unido e EUA.

Para mais informações sobre a Indium Corporation, visite www.indium.com ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer To^Another® (#FOETA), em www.linkedin.com/company/indium-corporation/.