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Indium Corporation Expert to Present Thermal Management Strategies for Next-Generation AI Applications at OCP Global Summit

CLINTON, N.Y., October 7, 2026 — Indium Corporation® Senior Applications Development Engineer, Engineered Solder Materials (ESM), Ryan Mayberry will discuss how advanced metal thermal interface materials (TIMs) and liquid-cooled cold plates work together to maximize heat removal, boosting AI/HPC application performance and efficiency, at the Open Computer Project (OCP) Global Summit, October 12-15, in San Jose, California.

The presentation, Latest Advancements with Thermal Interface Materials, will present test data that quantifies how liquid metal TIMs and liquid-cooled cold plate co-optimization influence performance from the silicon interface through the cooling loop to data center-level metrics. Results will show how a 10°C die-level temperature reduction can propagate through the cooling architecture, increasing thermal headroom, supporting higher coolant operating temperatures, reducing cooling energy demand, and improving efficiency metrics such as PUE and compute performance per watt. The study was conducted in collaboration with CoolIT Systems.

Ryan Mayberry leads the application development team for the Indium Corporation ESM product line. He collaborates across internal functions to develop process recommendations, build test platforms and prototype assemblies, and support new product introduction, primarily in the growing power electronics and thermal management market segments.

OCP Global Summit visitors can attend Mayberry’s presentation on October 15, 12:30 PDT. To learn more about Indium Corporation’s TIMs solutions, visit indium.com.

À propos d'Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Mexico, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.