CLINTON, N.Y., October 7, 2026 — Indium Corporation® Senior Applications Development Engineer, Engineered Solder Materials (ESM), Ryan Mayberry will discuss how advanced metal thermal interface materials (TIMs) and liquid-cooled cold plates work together to maximize heat removal, boosting AI/HPC application performance and efficiency, at the Open Computer Project (OCP) Global Summit, October 12-15, in San Jose, California.
The presentation, Latest Advancements with Thermal Interface Materials, will present test data that quantifies how liquid metal TIMs and liquid-cooled cold plate co-optimization influence performance from the silicon interface through the cooling loop to data center-level metrics. Results will show how a 10°C die-level temperature reduction can propagate through the cooling architecture, increasing thermal headroom, supporting higher coolant operating temperatures, reducing cooling energy demand, and improving efficiency metrics such as PUE and compute performance per watt. The study was conducted in collaboration with CoolIT Systems.
Ryan Mayberry leads the application development team for the Indium Corporation ESM product line. He collaborates across internal functions to develop process recommendations, build test platforms and prototype assemblies, and support new product introduction, primarily in the growing power electronics and thermal management market segments.
OCP Global Summit visitors can attend Mayberry’s presentation on October 15, 12:30 PDT. To learn more about Indium Corporation’s TIMs solutions, visit indium.com.
關於 Indium Corporation
IndiumCorporation®是全球電子、半導體、薄膜及熱管理市場中首屈一指的材料精煉商、冶煉商、製造商及供應商。 產品涵蓋焊料與助焊劑、釬料、熱界面材料、濺鍍靶材、銦、鎵、鍺及錫等金屬與無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球技術支援網絡，並在中國、德國、印度、馬來西亞、墨西哥、新加坡、南韓、英國及美國設有工廠。
如需了解更多關於 Indium Corporation 的資訊，請造訪www.indium.com或發送電子郵件至[email protected]。您也可以在www.linkedin.com/company/indium-corporation/ 上追蹤我們的專家團隊「From One Engineer ToAnother®」（#FOETA）。
