CLINTON, N.Y., October 7, 2026 — Indium Corporation® Senior Applications Development Engineer, Engineered Solder Materials (ESM), Ryan Mayberry will discuss how advanced metal thermal interface materials (TIMs) and liquid-cooled cold plates work together to maximize heat removal, boosting AI/HPC application performance and efficiency, at the Open Computer Project (OCP) Global Summit, October 12-15, in San Jose, California.
The presentation, Latest Advancements with Thermal Interface Materials, will present test data that quantifies how liquid metal TIMs and liquid-cooled cold plate co-optimization influence performance from the silicon interface through the cooling loop to data center-level metrics. Results will show how a 10°C die-level temperature reduction can propagate through the cooling architecture, increasing thermal headroom, supporting higher coolant operating temperatures, reducing cooling energy demand, and improving efficiency metrics such as PUE and compute performance per watt. The study was conducted in collaboration with CoolIT Systems.
Ryan Mayberry leads the application development team for the Indium Corporation ESM product line. He collaborates across internal functions to develop process recommendations, build test platforms and prototype assemblies, and support new product introduction, primarily in the growing power electronics and thermal management market segments.
OCP Global Summit visitors can attend Mayberry’s presentation on October 15, 12:30 PDT. To learn more about Indium Corporation’s TIMs solutions, visit indium.com.
关于铟泰铟泰公司
铟泰公司®是面向全球电子、半导体、薄膜及热管理 市场的顶级材料精炼商、冶炼商、制造商和供应商。 产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡金属及无机化合物 ；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度 、马来西亚 、墨西哥 、新加坡 、韩国、英国和美国设有工厂。
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