Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at Strategies in Light, Feb. 24-26 in Las Vegas, Nev.
The use of high-power LEDs is growing exponentially due to light quality, energy efficiency, and reliability. These attributes are directly related to design and assembly methods and materials.
Indium Corporation’s Heat-Spring is a compressible interface material that provides 86W/mK of thermal conductivity using a pressure range of only 35 to 100+ psi. Heat-Spring offers superior conductivity and ease of use as compared to thermal grease alternatives. In addition, Heat-Spring will not bake out or pump out, optimizing long-term performance consistency and eliminating the rework process.
Heat-Spring is reclaimable and recyclable, and is packaged in custom trays or tape & reel.
Heat-Spring is just one of a wide range of Indium Corporation materials for the LED assembly industry, from PCB assembly to die-attach to technology-enabling TIM, that combines superior performance with ease of placement. This reduces cost, increases first-pass yield, reduces field failures, and contributes to the optimization of profit.
For more information on Heat-Spring, visit indiumstg.wpenginepowered.com/thermal-interface-materials/heat-spring or visit Indium Corporation at booth 623.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, energia solar, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a Indium tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
