Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at Strategies in Light, Feb. 24-26 in Las Vegas, Nev.
The use of high-power LEDs is growing exponentially due to light quality, energy efficiency, and reliability. These attributes are directly related to design and assembly methods and materials.
Indium Corporation’s Heat-Spring is a compressible interface material that provides 86W/mK of thermal conductivity using a pressure range of only 35 to 100+ psi. Heat-Spring offers superior conductivity and ease of use as compared to thermal grease alternatives. In addition, Heat-Spring will not bake out or pump out, optimizing long-term performance consistency and eliminating the rework process.
Heat-Spring is reclaimable and recyclable, and is packaged in custom trays or tape & reel.
Heat-Spring is just one of a wide range of Indium Corporation materials for the LED assembly industry, from PCB assembly to die-attach to technology-enabling TIM, that combines superior performance with ease of placement. This reduces cost, increases first-pass yield, reduces field failures, and contributes to the optimization of profit.
For more information on Heat-Spring, visit indiumstg.wpenginepowered.com/thermal-interface-materials/heat-spring or visit Indium Corporation at booth 623.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
