Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at Strategies in Light, Feb. 24-26 in Las Vegas, Nev.
The use of high-power LEDs is growing exponentially due to light quality, energy efficiency, and reliability. These attributes are directly related to design and assembly methods and materials.
Indium Corporation’s Heat-Spring is a compressible interface material that provides 86W/mK of thermal conductivity using a pressure range of only 35 to 100+ psi. Heat-Spring offers superior conductivity and ease of use as compared to thermal grease alternatives. In addition, Heat-Spring will not bake out or pump out, optimizing long-term performance consistency and eliminating the rework process.
Heat-Spring is reclaimable and recyclable, and is packaged in custom trays or tape & reel.
Heat-Spring is just one of a wide range of Indium Corporation materials for the LED assembly industry, from PCB assembly to die-attach to technology-enabling TIM, that combines superior performance with ease of placement. This reduces cost, increases first-pass yield, reduces field failures, and contributes to the optimization of profit.
For more information on Heat-Spring, visit www.indium.com/thermal-interface-materials/heat-spring or visit Indium Corporation at booth 623.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, del solare, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
Per ulteriori informazioni su Indium Corporation, visitare il sito www.indium.com o inviare un'e-mail a [email protected].
