Indium Corporation will feature its high-reliability precision AuSn Solder Preforms at the 48th NEPCON Japan, Jan. 16-18 in Tokyo, Japan.
Indium Corporation's AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. The semiconductor-grade AuSn preforms are designed to meet industry challenges as devices continue to get smaller, with increasing power density and power ratings.
Depending on the alloy, gold-based solders have a melting point ranging from 280-1,064°C, making it compatible with subsequent reflow processes. Additionally, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength.
Indium Corporation's Pb-free and RoHS-compliant AuSn solder preforms are available in a variety of standard and custom-engineered designs.
For more information about Indium Corporation's AuSn solder preforms, see our experts at the show or visit www.indium.com/gold.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
Para mais informações sobre a Indium Corporation, visite www.indium.com ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer To Another® (#FOETA), em www.facebook.com/indium ou @IndiumCorp.
