Indium Corporation to Feature AuSn Solder Preforms at NEPCON Japan 2019

Indium Corporation will feature its high-reliability precision AuSn Solder Preforms at the 48^th NEPCON Japan, Jan. 16-18 in Tokyo, Japan.

Indium Corporation's AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. The semiconductor-grade AuSn preforms are designed to meet industry challenges as devices continue to get smaller, with increasing power density and power ratings.

Depending on the alloy, gold-based solders have a melting point ranging from 280-1,064°C, making it compatible with subsequent reflow processes. Additionally, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength.

Indium Corporation's Pb-free and RoHS-compliant AuSn solder preforms are available in a variety of standard and custom-engineered designs.

For more information about Indium Corporation's AuSn solder preforms, see our experts at the show or visit indiumstg.wpenginepowered.com/gold.

铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；^{以及NanoFoil®。}该公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚 、新加坡 、韩国、英国和美国设有工厂。

如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer To^Another®”（#FOETA）。