CLINTON, N.Y., February 27, 2026 — Indium Corporation® will highlight high-reliability liquid metal technology and metal thermal interface material (TIM) products at SEMI-THERM 2026, March 9-12, in San Jose, California.
Indium Corporation will showcase the following products:
- Liquid Metal TIMs are designed to provide superior thermal conductivity for both TIM0 and TIM1 applications. They offer high thermal conductivity to enhance end-product longevity and reliability, low interfacial resistance against most surfaces to dissipate heat quickly, and extraordinary wetting ability to both metallic and nonmetallic surfaces. Liquid Metal TIMs are available in a variety of alloys, including InGa and InGaSn.
- Solder TIMs deliver superior heat dissipation and high thermal conductance for power-dense devices exceeding 1,000 watts. Optimized for BGA package applications, TIMs enable low-void, high-reliability performance across multiple reflow cycles, ensuring thermal stability. Unlike fluidic solutions, they ensure reliable end-of-life performance, preventing failures common with greases. Ideal for portable electronics, TIMs enhance battery life, reduce cooling fan size, and minimize heat-sink mass while maintaining RoHS compliance and supporting sustainability initiatives.
- Heat-Spring® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems and offers a sustainable solution through the company’s metals and compounds reclaim and recycle program.
- O Heat-Spring®HSxé um TIM metálico compressível e sem refluxo, concebido para matrizes de grande área com empenamento de 200 microns ou mais. Proporciona uma condutividade térmica de 16 W/mK a apenas 20 psi,tornando-o ideal para cabeças de teste com forças de fixação de 30 psi ou menos. Disponível em espessuras que variam entre 300 microns e 1 mm, pode ser personalizado com ou sem uma barreira de difusão para evitar manchas no die.
- Phase-Change Metal Alloy (PCMA) TIMs are low-melting alloys, solid at room temperature, with a melting point as low as 30°C. They provide exceptional thermal conductivity and reliability for TIM1.5 applications, offering thermal performance similar to liquid metal. This allows for better volume control and efficient use in high-volume production. PCMA TIMs are available in Ga-based and Ga-free options.
To learn more about Indium Corporation’s liquid metal technology and other thermal management products, visit indium.com or meet with our experts at SEMI-THERM booth #303.
Sobre a Indium Corporation
A IndiumCorporation® é uma empresa líder na refinação, fundição, fabrico e fornecimento de materiais para os mercados globais de eletrónica, semicondutores, películas finas e gestão térmica. Os produtos incluem soldas e fluxos; ligas de brasagem; materiais de interface térmica; alvos de pulverização catódica; metais e compostos inorgânicos de índio, gálio, germânio e estanho; eNanoFoil®. Fundada em 1934, a empresa dispõe de apoio técnico global e fábricas localizadas na China, Alemanha, Índia, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
Para mais informações sobre a Indium Corporation, visite indiumstg.wpenginepowered.com ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer ToAnother® (#FOETA), em www.linkedin.com/company/indium-corporation/.
