Indium Corporation will feature its high-temperature solder paste, BiAgX® at the China Semiconductor Packaging & Test Seminar (CSPT) 2018, Nov. 19-21, in Hefei, Anhui, China.
Indium Corporation’s BiAgX® is a high-melting, Pb-free solder paste technology that serves as a drop-in replacement for the high-Pb solders used in many high-reliability die-attach and electronics assembly applications.
BiAgX® is suitable for small, low-voltage QFN packages that are used in portable electronics, automotive electronics, and industrial applications. It requires no capital expenditures and minimal process adjustments for customers converting from a standard high Pb-containing process. It is both Pb-free and Sb-free and does not contain costly specialty materials, such as nanosilver or sintering aids.
BiAgX® reflows, solders, wets, and solidifies just like any other solder paste, and is available in both dispense and printing forms. Flux residues are easily cleanable with standard cleaning chemistries and processes.
See our experts on the show floor or visit indiumstg.wpenginepowered.com/BiAgX (www.indiumchina.cn/products/solder-paste-and-powder/biagx/) for more information about BiAgX®.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
