Indium Corporation will feature its high-temperature solder paste, BiAgX® at the China Semiconductor Packaging & Test Seminar (CSPT) 2018, Nov. 19-21, in Hefei, Anhui, China.
Indium Corporation’s BiAgX® is a high-melting, Pb-free solder paste technology that serves as a drop-in replacement for the high-Pb solders used in many high-reliability die-attach and electronics assembly applications.
BiAgX® is suitable for small, low-voltage QFN packages that are used in portable electronics, automotive electronics, and industrial applications. It requires no capital expenditures and minimal process adjustments for customers converting from a standard high Pb-containing process. It is both Pb-free and Sb-free and does not contain costly specialty materials, such as nanosilver or sintering aids.
BiAgX® reflows, solders, wets, and solidifies just like any other solder paste, and is available in both dispense and printing forms. Flux residues are easily cleanable with standard cleaning chemistries and processes.
See our experts on the show floor or visit indiumstg.wpenginepowered.com/BiAgX (www.indiumchina.cn/products/solder-paste-and-powder/biagx/) for more information about BiAgX®.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがある。1934年に設立され、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
