Indium Corporation will feature its high-temperature solder paste, BiAgX® at the China Semiconductor Packaging & Test Seminar (CSPT) 2018, Nov. 19-21, in Hefei, Anhui, China.
Indium Corporation’s BiAgX® is a high-melting, Pb-free solder paste technology that serves as a drop-in replacement for the high-Pb solders used in many high-reliability die-attach and electronics assembly applications.
BiAgX® is suitable for small, low-voltage QFN packages that are used in portable electronics, automotive electronics, and industrial applications. It requires no capital expenditures and minimal process adjustments for customers converting from a standard high Pb-containing process. It is both Pb-free and Sb-free and does not contain costly specialty materials, such as nanosilver or sintering aids.
BiAgX® reflows, solders, wets, and solidifies just like any other solder paste, and is available in both dispense and printing forms. Flux residues are easily cleanable with standard cleaning chemistries and processes.
See our experts on the show floor or visit indiumstg.wpenginepowered.com/BiAgX (www.indiumchina.cn/products/solder-paste-and-powder/biagx/) for more information about BiAgX®.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Märkte für Elektronik, Halbleiter, Dünnschichten und Wärmemanagement. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
