Indium Corporation will feature its high-temperature solder paste, BiAgX® at the China Semiconductor Packaging & Test Seminar (CSPT) 2018, Nov. 19-21, in Hefei, Anhui, China.
Indium Corporation’s BiAgX® is a high-melting, Pb-free solder paste technology that serves as a drop-in replacement for the high-Pb solders used in many high-reliability die-attach and electronics assembly applications.
BiAgX® is suitable for small, low-voltage QFN packages that are used in portable electronics, automotive electronics, and industrial applications. It requires no capital expenditures and minimal process adjustments for customers converting from a standard high Pb-containing process. It is both Pb-free and Sb-free and does not contain costly specialty materials, such as nanosilver or sintering aids.
BiAgX® reflows, solders, wets, and solidifies just like any other solder paste, and is available in both dispense and printing forms. Flux residues are easily cleanable with standard cleaning chemistries and processes.
See our experts on the show floor or visit indiumstg.wpenginepowered.com/BiAgX (www.indiumchina.cn/products/solder-paste-and-powder/biagx/) for more information about BiAgX®.
Indium Corporation est un fabricant et fournisseur de matériaux de premier plan sur les marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques à base d'indium, de gallium, de germanium et d'étain, ainsi que des NanoFoil®. Fondée en 1934, l'entreprise dispose d'une assistance technique mondiale et d'usines situées en Chine, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
