Indium Corporation will feature its high-temperature solder paste, BiAgX® at the China Semiconductor Packaging & Test Seminar (CSPT) 2018, Nov. 19-21, in Hefei, Anhui, China.
Indium Corporation’s BiAgX® is a high-melting, Pb-free solder paste technology that serves as a drop-in replacement for the high-Pb solders used in many high-reliability die-attach and electronics assembly applications.
BiAgX® is suitable for small, low-voltage QFN packages that are used in portable electronics, automotive electronics, and industrial applications. It requires no capital expenditures and minimal process adjustments for customers converting from a standard high Pb-containing process. It is both Pb-free and Sb-free and does not contain costly specialty materials, such as nanosilver or sintering aids.
BiAgX® reflows, solders, wets, and solidifies just like any other solder paste, and is available in both dispense and printing forms. Flux residues are easily cleanable with standard cleaning chemistries and processes.
See our experts on the show floor or visit indiumstg.wpenginepowered.com/BiAgX (www.indiumchina.cn/products/solder-paste-and-powder/biagx/) for more information about BiAgX®.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
