Indium Corporation will feature selections from its portfolio of proven products for power electronics applications at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), February 13 in Miami, Florida. In addition, Indium Corporations Principal Engineer and Manager for the Thermal Interface Materials Applications, Dr. Andy Mackie, will chair a technical session on interconnects and lead attachments on February 2.
Amongst the companys award-winning portfolio of proven products for power electronics, Indium Corporation will feature:
- Os InFORMS são fabricos de liga de solda reforçada que melhoram a fiabilidade mecânica e térmica e são especificamente concebidos para produzir uma espessura de linha de ligação consistente para aplicações de módulos de potência. Também abordam desafios específicos para a indústria de eletrónica de potência, fornecendo um material melhorado para o desenvolvimento de módulos mais fiáveis e de maior desempenho.
- InTACK is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost tooling-free solution without compromising soldering quality.
- QuickSinter is a high metal content paste, redefining sinter technology for power electronics. Available in pressureless and pressure formulations, this portfolio of sintering solutions delivers products engineered for customers specific application needs.
- Durafuse HT apresenta um novo design baseado numa nova tecnologia de liga, concebida para fornecer uma pasta rica em estanho e sem chumbo a alta temperatura (HTLF), apresentando os méritos de ambas as ligas constituintes. Durafuse HT proporciona um processamento simplificado, sem necessidade de equipamento especial, e uma maior fiabilidade em termos de ciclos térmicos, igual ou superior à de uma solda com elevado teor de PB.
Dr. Mackie is an electronics industry expert with a technical background in physical chemistry, surface chemistry, rheology, and semiconductor fabrication and assembly materials and processes. His professional experience covers all aspects of electronics manufacturing from wafer fabrication to semiconductor packaging and SMT/electronics assembly. In his current role, he is focused on identifying thermal material needs and trends for various high-performance applications, as well as the development and testing of innovative solutions to meet the emerging thermal interface material requirements. Dr. Mackie has been an invited international keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology. He holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation. Dr. Mackie holds a Ph.D. in physical chemistry from the University of Nottingham, UK, and a Masters of Science (MSc) in colloid and interface science from the University of Bristol, UK.
Sobre a Indium Corporation
A Indium Corporation é um dos principais refinadores, fundidores, fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Alemanha, Índia, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
Para mais informações sobre a Indium Corporation, visite www.indium.com ou envie um e-mail para Jingya Huang. Também pode seguir os nossos especialistas, From One Engineer To Another (#FOETA), em www.linkedin.com/company/indium-corporation/ ou @IndiumCorp.
About 3D-PEIM
3D-PEIM brings synergistic advances in component design and integration combined with 3D manufacturing technologiescustomized to different market segments such as computing, automotive industry, energy sector, and low-power medical and wearables systems. The technical program assembles world-class experts representing a far-reaching range of cross-disciplinary perspectives exploring the path to design, development, and manufacturing of future 3D power electronics systems.
