Indium Corporation will feature selections from its portfolio of proven products for power electronics applications at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), February 13 in Miami, Florida. In addition, Indium Corporations Principal Engineer and Manager for the Thermal Interface Materials Applications, Dr. Andy Mackie, will chair a technical session on interconnects and lead attachments on February 2.
Amongst the companys award-winning portfolio of proven products for power electronics, Indium Corporation will feature:
- InFORMS are reinforced solder alloy fabrications that improve mechanical and thermal reliability and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
- InTACK is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost tooling-free solution without compromising soldering quality.
- QuickSinter is a high metal content paste, redefining sinter technology for power electronics. Available in pressureless and pressure formulations, this portfolio of sintering solutions delivers products engineered for customers specific application needs.
- Durafuse HT features a novel design based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.
Dr. Mackie is an electronics industry expert with a technical background in physical chemistry, surface chemistry, rheology, and semiconductor fabrication and assembly materials and processes. His professional experience covers all aspects of electronics manufacturing from wafer fabrication to semiconductor packaging and SMT/electronics assembly. In his current role, he is focused on identifying thermal material needs and trends for various high-performance applications, as well as the development and testing of innovative solutions to meet the emerging thermal interface material requirements. Dr. Mackie has been an invited international keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology. He holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation. Dr. Mackie holds a Ph.D. in physical chemistry from the University of Nottingham, UK, and a Masters of Science (MSc) in colloid and interface science from the University of Bristol, UK.
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至Jingya Huang。您还可以关注我们的专家团队“From One Engineer To Another”（#FOETA），访问www.linkedin.com/company/indium-corporation/或关注@IndiumCorp。
关于 3D-PEIM
3D-PEIM 在组件设计和集成方面取得了协同进步，并结合了针对不同细分市场（如计算机、汽车工业、能源行业以及低功耗医疗和可穿戴设备系统）定制的 3D 制造技术。该技术项目汇集了世界一流的专家，他们代表着深远的跨学科视角，探索未来三维电力电子系统的设计、开发和制造之路。
