Indium Corporation will feature selections from its portfolio of proven products for power electronics applications at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), February 13 in Miami, Florida. In addition, Indium Corporations Principal Engineer and Manager for the Thermal Interface Materials Applications, Dr. Andy Mackie, will chair a technical session on interconnects and lead attachments on February 2.
Amongst the companys award-winning portfolio of proven products for power electronics, Indium Corporation will feature:
- InFORMS est un alliage de soudure renforcé qui améliore la fiabilité mécanique et thermique et qui est spécialement conçu pour produire une épaisseur de soudure constante pour les applications de modules de puissance. Ils répondent également aux défis spécifiques de l'industrie de l'électronique de puissance en fournissant un matériau amélioré pour le développement de modules plus fiables et plus performants.
- InTACK is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost tooling-free solution without compromising soldering quality.
- QuickSinter is a high metal content paste, redefining sinter technology for power electronics. Available in pressureless and pressure formulations, this portfolio of sintering solutions delivers products engineered for customers specific application needs.
- Durafuse HT présente une nouvelle conception basée sur une nouvelle technologie d'alliage, conçue pour fournir une pâte riche en étain et sans plomb à haute température (HTLF), présentant les mérites des deux alliages constitutifs. Durafuse HT offre un traitement simplifié, sans équipement spécial, et une fiabilité accrue des cycles thermiques égale ou supérieure à celle d'une brasure à haute teneur en plomb.
Dr. Mackie is an electronics industry expert with a technical background in physical chemistry, surface chemistry, rheology, and semiconductor fabrication and assembly materials and processes. His professional experience covers all aspects of electronics manufacturing from wafer fabrication to semiconductor packaging and SMT/electronics assembly. In his current role, he is focused on identifying thermal material needs and trends for various high-performance applications, as well as the development and testing of innovative solutions to meet the emerging thermal interface material requirements. Dr. Mackie has been an invited international keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology. He holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation. Dr. Mackie holds a Ph.D. in physical chemistry from the University of Nottingham, UK, and a Masters of Science (MSc) in colloid and interface science from the University of Bristol, UK.
À propos d'Indium Corporation
Indium Corporation est un raffineur, un fondeur, un fabricant et un fournisseur de matériaux de premier plan pour les marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques d'indium, de gallium, de germanium et d'étain, ainsi que des feuilles NanoFoil. Fondée en 1934, l'entreprise dispose d'une assistance technique mondiale et d'usines situées en Chine, en Allemagne, en Inde, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
About 3D-PEIM
3D-PEIM brings synergistic advances in component design and integration combined with 3D manufacturing technologiescustomized to different market segments such as computing, automotive industry, energy sector, and low-power medical and wearables systems. The technical program assembles world-class experts representing a far-reaching range of cross-disciplinary perspectives exploring the path to design, development, and manufacturing of future 3D power electronics systems.
