Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.
This brief video, which can be found at indiumstg.wpenginepowered.com/blog/phil-zarrow, features Indium Corporation Technical Support Engineer Derrick Herron as he explains to SMT expert Phil Zarrow, President and Principal Consultant for ITM Consulting, how voiding can be consistently reduced to 12 percent with the use of solder preforms.
“Voiding can lead to hot spots in the component, which will eventually lead to a shortened life span,” Herron said. “By limiting voiding, heat is transferred more efficiently into the PCB and away from the component.”
Herron provides technical service to customers in the northeastern United States. Previously, he spent more than six years developing solder paste and flux technologies in Indium Corporation’s research and development laboratory. Herron earned his bachelor’s degree in chemistry from Oklahoma State University, Stillwater, Okla. He received his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is certified in IPC-A-600 and IPC-A-610-D. He also authors a blog on engineered solders, which can be found at indiumstg.wpenginepowered.com/blog/derrick-herron.
Zarrow está envolvido no fabrico e montagem de PCB há mais de 35 anos. Para além da sua experiência em montagem e limpeza automatizadas, Zarrow é reconhecido pela sua competência em tecnologia de soldadura por refluxo de montagem em superfície e na conceção e implementação de equipamento de colocação SMT e sistemas de soldadura por refluxo. A sua vasta experiência prática inclui também a configuração e resolução de problemas de processos de orifícios passantes e SMT em todo o mundo.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina, gestão térmica e solar. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a Indium tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
