Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.
This brief video, which can be found at indiumstg.wpenginepowered.com/blog/phil-zarrow, features Indium Corporation Technical Support Engineer Derrick Herron as he explains to SMT expert Phil Zarrow, President and Principal Consultant for ITM Consulting, how voiding can be consistently reduced to 12 percent with the use of solder preforms.
“Voiding can lead to hot spots in the component, which will eventually lead to a shortened life span,” Herron said. “By limiting voiding, heat is transferred more efficiently into the PCB and away from the component.”
Herron provides technical service to customers in the northeastern United States. Previously, he spent more than six years developing solder paste and flux technologies in Indium Corporation’s research and development laboratory. Herron earned his bachelor’s degree in chemistry from Oklahoma State University, Stillwater, Okla. He received his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is certified in IPC-A-600 and IPC-A-610-D. He also authors a blog on engineered solders, which can be found at indiumstg.wpenginepowered.com/blog/derrick-herron.
ザローは35年以上にわたってPCB製造とアセンブリに携わってきた。自動組立と洗浄の経歴に加え、ザロー氏は表面実装リフローはんだ付け技術、SMT配置装置とリフローはんだ付けシステムの設計と実装の専門家として知られています。彼の豊富な実務経験には、世界中のスルーホールやSMTプロセスのセットアップやトラブルシューティングも含まれる。
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理、太陽電池市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがあります。1934年に設立されたインジウムは、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を有しています。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
