Next week is the International Microwave Symposium in Philadelphia, PA. For most of you, this is the tail end of the trade show season and you’re getting little burnt out, but this is one show you can’t miss. For Indium Corporation, this is one of our biggest shows in Northeast, and we look forward to networking with our customers and learning about new applications within this exciting market.
Indium Corporation will be promoting our gold-tin preforms and die-attach solder pastes for RF package applications.
Please stop by and ask us about our Quick Turn Program for new Au preform designs for prototypes. Please stop by to visit us at booth #348 and let us know how we can help you on future projects.