A lot has changed in the world of package-on-package in the last few years. The most obvious change that I have seen is the development of specialized pastes for component dipping. If you haven’t tried one of these pastes, here are 8 reasons why you should:
8) More consistent transfer over time
7) Head-in-pillow elimination
6) Better wetting to a range of alloys
5) Optimized metal loading
4) Specially designed powder distribution
3) Halogen-free flux formulations
1) Higher possible yields
In today's fast-paced world, where sustainability and environmental responsibility are paramount, Indium Corporation is leading the charge with an innovative approach to resource management. Our
Navigating today’s competitive business landscape demands innovative strategies for cost management and operational efficiency. Indium Corporation's Reclaim and Recycle Program addresses
Unlock new efficiencies in your manufacturing process with Indium Corporation's Reclaim and Recycle Program—a visionary approach that turns post-manufacturing scrap into valuable resources.
