I love exciting blogs, they are a change of pace in our industry. Here's a new one that you should check out: Françoise in 3D. It offers a growing base of knowledge that is geared towards the evolving field of 3D IC packaging innovation. I'm not sure where the topic boundaries are set, but I hope we will see some entries regarding package-on-package (PoP) assembly or design.
Good luck Françoise, we look forward to your foresight in this 3 dimensional world!