Spheres are a great solder form for prototype work. (Pictured here are a range of sphere sizes, BGA size compared to flip chip size.) Solder spheres are most commonly used for package-level and chip-level interconnection, although they are essentially a consistent solder volume for many applications. Most alloys can be made into spheres .003” to .100” in diameter to suit your needs.
Consider Solder Spheres
Indium Corporation Blogging Team
Indium Corporation Blogging Team
Our blogging team includes engineers, researchers, product specialists, and industry leaders. We share expertise in solder materials, electronics assembly, thermal management, and advanced manufacturing. Our blog offers insights, technical knowledge, and solutions to inspire professionals, showcasing product innovations, trends, and best practices to help readers excel in a competitive industry.
