Indium Blog

Consider Solder Spheres

  • Solder Alloys
  • BGA
  • Indium Corporation
  • Solder
  • Solder Spheres
  • Solderability

  • Spheres are a great solder form for prototype work. (Pictured here are a range of sphere sizes, BGA size compared to flip chip size.) Solder spheres are most commonly used for package-level and chip-level interconnection, although they are essentially a consistent solder volume for many applications. Most alloys can be made into spheres .003” to .100” in diameter to suit your needs.

    Authored by previous Indium Application Manager Jim Hisert