Indium Blog

Day 1 of the Device Packaging Conference

  • Flux
  • Indium Corporation
  • Gold Solder

  • Today I was able to attend a professional development course related to Package-on-Package technology and trends. While the session was very informative, it seems that there has been little consideration given to multiple solderpaste/flux suppliers in the generation of data for the course.

    In any event, it is nice to see where the industry is headed with this assembly process – and how we can meet technological expectations in the years to come.

    Authored by previous Indium Application Manager Jim Hisert