Indium Blog

Electronics Cooling Article Discusses Variety of Thermal Interface (TIM) Applications

Most articles I have read regarding Thermal Interface Materials (TIMs) focus on one application. Others generally focus on only one material (the material the author is promoting). In the case of a recent Electronics Cooling article Application of Metallic TIMs for Harsh Environments and Non-flat Surfaces, multiple materials and multiple application issues are discussed. I find that the scope of the article makes it perfect for someone learning about thermal interface materials in general, but it also contains value for those of us working with a specific application or material.

Mentioned in the article are:


  • Silicone-Filled Compounds
  • Phase-Change Compounds
  • Liquid Metal Alloys
  • Indium and Indium Alloys (this is what I was particularly interested in)
  • Pyrolytic Graphite
  • Highly-Oriented Pyrolytic Graphite


  • Aerospace
  • Geothermal
  • Mobile Devices
  • Integrated Circuits / Burn-in and Test
  • IGBT Modules
  • RF
  • Telecommunications
  • Radar


  • Non-Flat Mounting
  • Harsh Environments
  • Bondline Thickness
  • Outgassing
  • Separation
  • Pump-Out
  • Clamping Force
  • Testing Thermal Resistance

I would advise you check this article out if you are working with any of the above listed materials, applications, or challenges. An even stronger recommendation goes out to anyone learning about thermal interface materials as they relate to a wide range of applications – this article is perfect for you!


Authored by previous Indium Application Manager Jim Hisert