Indium Blog

Engineer to Engineer at IMAPS in North Carolina

Indium Corporation will be at IMAPS 2010 (International Microelectronics and Packaging Society) - their 43rd International Symposium on Microelectronics - again this year, doing what we do best: talking From One Engineer to Another.
Our booth will feature a strong team of experts from our Solder Preforms, Solder Paste and NanoFoil programs.  We will have samples and displays that will give you the chance to partner with us on your soldering, joining, bonding, or other material challenges and to find an efficient solution.

You can get all the details for the technical programs at the IMAPS web site.  They provide five different tracks including: 3D packaging, modeling and reliability, next generation materials, assembly and packaging, and advanced technologies.

And then, of course, there are the booths.  IMAPS 2010 provides both exhibitors and visitors the chance to talk face to face and sketch out processes and find solutions.  Come visit us at Booth 415.  You can talk with Chris Nash, Seth Homer, Tommy Acchione and me to get insight into the latest materials.

If you wouldl like a free pass to the exhibit hall, contact me at and I will send one out to you.  The exhibits start on Tuesday November 2nd and continue through Thursday November 4th.  We hope to see you there!