Images stolen (with permission) from the Power-Semiconductor Blog
In a recent posting by Andy Mackie, wetting balance testing was revealed for what it really is – a test that was not designed for the advanced electronics industry.I’ll go the next step and say it has no place in the advanced packaging industry.Either way, make sure you check out Andy’s post.
At Indium Corporation, we understand the challenges related to power electronics assembly; devices are increasing in complexity, while demands on performance and reliability grow stronger. On top of
Folks, The creation of solder balls, when assembling passive discrete components, has been an issue for decades (see Figure 1). The discovery that the “home plate” stencil aperture design
In the world of medical device manufacturing, where reliability and precision are critical, materials used in the assembly must meet the highest
