For fun, I decided to interview our very own Brandon Judd to talk about Indium Corporation Technical Support, the Southwest United States, and an upcoming tradeshow.
Jim: Brandon, you’re our Technical Support Engineer for the Southwest region of the U.S. What does that title entail?
Brandon: On a day-to-day basis it is my job to support customers with product recommendations and process suggestions/troubleshooting via email and phone. I also travel to the Southwest region frequently to provide customers with assistance during product evaluations.
Jim: There must be some things you have grown to love about the Southwest?
Brandon: Absolutely. This region contains a very diverse selection of different manufacturing companies which utilize our products, including down-hole, medical, military, and automotive just to name a few. Every application is different, which definitely keeps it interesting.
Jim: And when you are back in the office you still have a chance to continue work on these applications, right?
Brandon: Correct. A large amount of my time is spent in our Advanced Materials and Process Development Lab working with our products in order to gain knowledge of how they react under certain process conditions, as well as working on customer material qualifications.
Jim: How can our readers learn more about what goes on in the Indium Corporation Advanced Materials and Process Development Lab?
Brandon: The Indium Corporation team of technologists is constantly working in our Advanced Materials and Process Development Lab. Whether we're evaluating equipment, testing new processes, or evaluating break-out solder paste formulations, we're always working. The best way to stay on top of our activities is to follow our blogs. Or, people can contact me directly. I love to talk about our accomplishments. My email is bjudd@indium.com.
Jim: Are there any interesting new papers or presentations planned for this year?
Brandon: Our group of engineers is always working on new white papers, application notes, etc. This is, of course, in addition to blog posts in which our engineers frequently provide information on particular subjects/applications related to our products and research. We also commonly present on new technology at trade shows such as APEX and SMTAI, just to name a couple.
There are some interesting presentations coming up in the Southwest U.S. at the annual SMTAI trade show in Fort Worth, TX this Oct. 13-17th:
- Ning-Cheng Lee, Corrosion Resistance of High Melting Lead-Free BiAgX Solder Joints (presentation)
- Ning-Cheng Lee, the Second Generation Shock Resistant and Thermally Reliable Low Ag SAC Solder Doped with Mn (presentation)
- Ning-Cheng Lee, Voiding at Assembly of SAC BGA with 57Bi42Sn1Ag Solder Paste (presentation)
- Brook Sandy-Smith, Measuring Tiny Solder Deposits with Accuracy and Repeatability (presentation)
- Brook Sandy-Smith, Probe Technologies to Improve First Pass Yields (presentation)
- Brook Sandy-Smith, Optimizing Assembly of QFNs (presentation)
- Brook Sandy-Smith, Aperture Design and Material Selection for Optimal Probe Testing Performance (presentation)
- Brook Sandy-Smith, Productivity and Profitability Assessment of Improved Pin Probe Testing (presentation)
- Tim Jensen, Alloy and Process Optimization for Low Ag Solders (presentation)
- Ron Lasky, Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing (presentation)
Jim: Thank you Brandon
If you plan on attending SMTAI, you’re not going to want to miss these presentations. Also, stop by and say hello to Brandon at our booth. (#318)