I don’t talk about thermal interface materials much anymore – we have a separate Indium Corporation blog about that. There was a time when promoting the use of indium as a thermal interface was my main goal. It has so many advantages over other thermal interface materials, like the ability to be cold welded, 86W/mK thermal conductivity, it can be reused in some situations, and it self passivates itself with a thin oxide skin. The important thing for you and I, is that it transfers heat away from the processors we work on.
Related Articles
Formic Acid Reflow Soldering: The New Technology that is Clean, Reliable, and Power Ready
At Indium Corporation, we understand the challenges related to power electronics assembly; devices are increasing in complexity, while demands on performance and reliability grow stronger. On top of
Au-mazing Solutions: How AuLTRA® Fine Wire Brings Gold Standard Precision to Medical Devices
In the world of medical device manufacturing, where reliability and precision are critical, materials used in the assembly must meet the highest
The Surge of Cu Sinter Paste
A little over a year ago, I posted about the increase in interest regarding Cu sintering. In the past 12 months, that interest has has surged, highlighting Cu sintering's suitability for various