Indium Blog

Industry Trend - Underwater Soldering

  • Indium Corporation
  • NanoFoil®
  • Solder
  • Soldering
  • Solder Joints
  • Solderability

  • As more and more of the electronics industry moves toward (SMA) Subaquatic Microelectronics Assembly, questions have arisen regarding safety aspects, solder joint quality, and reflow profiling. We believe all 3 of these concerns can be resolved by using NanoFoil®.  


    Happy April fool’s day!


    Authored by previous Indium Application Manager Jim Hisert