Stages of a Reflow Profile: Part III
What is the ideal time-above liquidus during solder reflow? Too long or too short can cause dewetting and charring, or not allow the intermetalli...
Kim Flanagan's Blog
Stages of a Reflow Profile: Part II
The second stage of a reflow profile activates the flux in the solder paste and prepares the solder for reflow. This can be a critical stage...
Choosing Flux-Coated Solder Preforms
Kimberly Flanagan, Technical Support Engineer, and Phil Zarrow examine the benefits of flux-coated solder preforms, and how they can improve the manuf...
Benefits of Solder Fortification Preforms
Kimberly Flanagan, Technical Support Engineer, and Phil Zarrow discuss how Solder Fortification® Preforms can help reduce voiding and increase joi...
How much flux should I use in my solder wire?
It is important to consider both the solder alloy density and the diameter of the wire when determining the ideal flux percent. This blog post tells&n...
Stages of a Reflow Profile: Part I
It is important to understand the different stages of a reflow profile and how they can affect the end solder joint. ...
An Introduction to InTEGRATED® Solder Preforms
Kim Flanagan, Technical Support Engineer, and Phil Zarrow overview the attributes and applications of InTEGRATED® solder preforms—a manufact...
Avoid the Void®: Beyond QFN Voiding
Kim Flanagan, Technical Support Engineer, and Phil Zarrow discuss how to Avoid the Void® by looking at four non-QFN void types—Kirkendall (c...
Best and Worst Times to Use Robotic Soldering
When are the most and least appropriate situations to use robotic soldering, versus other soldering techniques?...
The New Generation of Soldering
The word ‘robot’ has acquired somewhat of a bad reputation in the manufacturing industry, just as the word 'automobile' was terrif...
Specifying Cryogenic Seals - with Kim Flanagan
Today we are speaking with Kim Flanagan (Technical Support Engineer) about specifying cryogenic seals....