Indium Blog

Low Residue Flip Chip Solder Paste

Low residue flux for flip chip attachment has many advantages (please see Ultra Low Res Flip Chip Flux) over standard no-clean and water soluble fluxes. Flux offers ease of use, although some applications require a solder paste to compensate for substrate warpage. This wish list (low residue, no-clean process, available in paste form, ect) can be satisfied by a low residue solder paste.

Authored by previous Indium Application Manager Jim Hisert