Indium Blog

NanoFoil® for LED Manufacture

NanoFoil® is especially well-suited for bonding LED packages. Here are some characteristics of the NanoBond® Process that fit high volume manufacturing:

  • NanoFoil can be supplied in tape & reel packaging, to utilize automated placement equipment.
  • Soldering times are measured in fractions of a second.
  • Activation of NanoFoil can be contact-less and automated (using laser ignition). Eliminating the need for cleaning heating equipment.
  • NanoFoil is ideal for cleanroom processes, as it does not outgas, and requires no flux.
  • NanoFoil is Pb- and Cd-Free.


Please let me know if I can help you evaluate NanoFoil® for your LED manufacturing process.


Authored by previous Indium Application Manager Jim Hisert