Indium Blog

Package-on-Package Reflow (5/5)

  • Ball Attach
  • Flux
  • Gold Solder
  • Indium Corporation
  • Solder
  • Solder Flux
  • Soldering
  • Solder Paste
  • Solderability

  • Okay, you’re at the final stage of Package-on-Package assembly. Simply heat per the reflow profile suggested by your solder manufacturer (hopefully us!). A cage should be placed over the components if they may come in contact with curtains on the reflow oven. Other than that, reflow is pretty strait forward. Assembling Package-on-Package components with solder paste will almost always contribute a little more voiding than using a ball attachment flux, but that is the tradeoff for increased solder volume.

    Authored by previous Indium Application Manager Jim Hisert