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In a collaboration between Indium, Dek, and FRT, a team was formed to evaluate flux printing for wafer level packaging. The results of the testing last week will be presented at the International

Writing an article is the hardest part of writing an article. It must have been said before, but actually sitting down and capturing what has been physically done and mentally learned is tougher for

Summer is here along with the heat waves that come with it. I am personally prepared with central air and barely-there clothing for when the heat gets most intense; but are my electronic gadgets as

My Co-Worker, Mike Fennerwrote an article in the June 2008 issue of OnBoard Technology (A Great Resource of SMT Electronics Literature). His article, Soldering: Is the Automotive Assembler Really

Some failures are easy to spot at time zero, others can appear over

"You do not merely want to be considered just the best of the best. You want to be considered theonlyone who does what you

As you may have seen on product data sheets or specifications, each flux is tested per industry standards for different parameters. One characteristic that is important to customers is viscosity.

I recently wrote an article for the Frost & Sullivan quarterly Sales & Marketing eBulletin titled, "Social Media Isn't Always Online". First of all, I sure picked a dumb title.

Sometimes Marketing Communications comesatthe B2B Marcom practitioner – and sometimes it is bad. Case in point,an articlethat is, in my opinion, pure trash, appeared in The Riley Report, a

Folks, I am giving a 3.5 hour RoHS and Lead-Free Assembly Workshopat ACI in Philadelpia on Wed, June 25. Come and join me, it is free. The ACI facility is near the airport and is pictured above.

Folks, Denmark, Finland and Sweden did a sweep of electronics products to check for RoHS compliance. Twenty two out of 152 products were non compliant….almost 15%. Yikes! With violation rates

I love good B2B Marcom, and I work hard creating (hopefully) good B2B Marcom at Indium Corporation. A recent concept that we brought to market several months ago is titled, Indium8.9: This is BIG! So

I was pleasantly surprised to see in the Summer 2008 edition of Thermal News, a thermally enhanced package was highlighted for its design by StratEdge. StratEdge, with its forward-looking design has

Dear Readers, This is the Blogs 100th entry, so I thought IҒd let you all know a little about what goes through my mind when I write an entry. Many readers ask How do you come up with your ideas?Ӕ,

Now I know you may be wondering why I have been slacking with my blog postings to the extent that you havent seen anything new in weeks, but I assure you that I will return to my regimented posting

No vulgarity here, but there is a lot of questions in the electronics industry as to whether the term "halogen-free should include Fluorine (F). Most activity only references chlorine (Cl) and

Last week, Michael Riddle (Cyber Technologies) and I experimented with liquid fluxes for spin coating / wafer bump reformation. We used a Cyberscan Vantage to examine the topography of the flux at

羊 羊毛 被子 “I paid two million to sit beside you!”随着Romano爽朗的笑声，我们开始了一个多小时飞机上的畅谈。

Anyone working with BGA solder joint reliability should be used to X-ray detection, made possible by Si-Li and Ge-Li as well as Cd-Te and Cd-Zn-Te. These materials sense the X-rays and convert them

I was doing a little online research just now and clicked on a link toan article on Inc.com. I was first served up a full-page ad that I could not get rid of. I was so intent on getting to the info I

Sometimes a new process goes against everything we know will work. Those applications are few, but revolutionary. Take, for instance, Package-on-Package assembly. As commonplace as it seems now, this