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My colleagues and I have had several conversations with customers wanting to use indium against an aluminum surface, either for the sake of creating a compression seal or thermal path. A troubling

Folks, Let’s look in on Patty…. Patty was really nervous. As a matter of fact, there was no time she remembered being this nervous. The cause of her nervousness? She was going to teach a

The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex. There are several variables that impact the

Folks, Imagine my excitement when Laurence Knight of the BBC contacted me to see if I was interested in being interviewed on the topic of tin pest, with a secondary discussion on tin

Over the last few years, miniaturization, and the drive for increased yields and lower defect rates, have forced the electronics manufacturing industry to focus more on the printing process to obtain

On Monday, March 24, I will be giving a professional development courseat the IPC APEX Expo in Las Vegas, Nevada. The course, Understanding and Solving Head-In-Pillow, Non-Wet Open, and QFN/CSP

While in South East Asia last summer, Indium's technical team and I had a chance to discuss flip-chip dipping processes with a major equipment

Dave Letterman, of late night talk show host fame, has made the Top Ten List a popular vehicle for comedy, but it is also often used to convey useful information in an easy to read

Capturing the absolute conviction of a true maven is, perhaps, the ultimate in promotion. Posers and spokesmodels need not apply. Advocacy, endorsement, and recommendation by someone this committed,

Folks, Pity the solder scientists of the late 1970s and early 1980s. SMT was an emerging technology and the world wanted to buy solder paste. However, the only experience many solder scientists had

Solderability and Wetting The wetting and spreading of solder onto surfaces is an essential part of forming a strong, reliable, conductive joint. The term "solderability"is a way of talking

Folks, My recent post on tin whiskers sparked the memory of tin pest in my mind. I have to admit, that with all of the legitimate reliability concerns related to tin whiskers, I am surprised that

Thank you to all of the readers who have followed Indium Corporation’s blog posts this year, and a special “thank you” to all the readers who have contacted us to learn

We recently worked with a company called Lambda Technologies who has helpedby providing a new solution to activating NanoFoil®: microwaves. Shown in the picture here is the MC3100 VFM. (The VFM

This year I had the pleasure of working with a circuit board company in Central New York called Standard Printed Circuits, Inc. From personal experience: they specialize in custom jobs, quick

Folks, Some years ago, a leading IC manufacturer decided that their R&D effort could benefit if analyzed for possible improvement – by hiring professionals from the arts (e.g. singers,

Indium metal powder is mixed with flux for application by dispensing or printing equipment. This mixture is referred to as solder paste.Lucky for you, Indium Corporation is the technology leader in

Indium and indium oxide powders can be used for research, chemical reactions, and forming near-net shape forms. What is a near-net shape form? Basically it is rough part that just needs final

Indium preforms offer very precise volumes of solder, and are cut to fit some very interesting bond-line shapes. Some examples of preform applications are: bonding lids on sealed packages, thermal

Indium ribbon can be made to various widths and thicknesses. It may also be called "foil" if it is over 4 inches wide. It is easily cut to form shapes for prototyping or small-scale

Indium wire is very different than the solder wire you find in hardware stores. To me, it’s like comparing a sports car and a go-kart. Each perform differently, are made for a very different